diff --git a/src/pages/about/team.vue b/src/pages/about/team.vue new file mode 100644 index 00000000..b48ddddf --- /dev/null +++ b/src/pages/about/team.vue @@ -0,0 +1,392 @@ + + + diff --git a/src/pages/index.vue b/src/pages/index.vue index 5fa76d01..5f2f8425 100644 --- a/src/pages/index.vue +++ b/src/pages/index.vue @@ -38,10 +38,30 @@ const sections = [ ] const editions = [ - { n: 1, year: '2001', desc: 'First publication' }, - { n: 2, year: '2006', desc: 'Expanded scope' }, - { n: 3, year: '2014', desc: 'Major revision' }, - { n: 4, year: '2021', desc: 'Current edition' }, + { + n: 1, year: '2004', status: 'Withdrawn', + iso: 'ISO 10303-210:2004', + desc: 'Established the foundational information model for PCA design data exchange.', + features: ['Product structure & classification', 'Physical design representation', 'Basic connectivity', 'Component library definitions'], + }, + { + n: 2, year: '2011', status: 'Withdrawn', + iso: 'ISO 10303-210:2011', + desc: 'Expanded scope for advanced packaging and interconnect modeling.', + features: ['Advanced packaging (BGA, CSP)', 'Layer stacks & via structures', 'Thermal & electrical properties', 'Design-to-usage view mapping'], + }, + { + n: 3, year: '2016', status: 'Withdrawn', + iso: 'ISO 10303-210:2016', + desc: 'Major revision introducing design rules, constraints, and functional decomposition.', + features: ['Design rules & constraints', 'Layer stack with stratum technology', 'Physical requirements capture', 'Interfacial connectivity'], + }, + { + n: 4, year: '2021', status: 'Current', + iso: 'ISO 10303-210:2021', + desc: 'The current edition — comprehensive coverage of electronic design data exchange.', + features: ['Full modular architecture', 'Design-through-manufacturing exchange', 'Material properties', 'Complex multi-layer PCA support'], + }, ] const heroCode = `SCHEMA AP210_Electronic_Assembly; @@ -153,7 +173,7 @@ END_SCHEMA;`
-
+

Evolution

@@ -164,23 +184,25 @@ END_SCHEMA;`
-
-
-
- - -
-
- {{ ed.year }} -
-
-
-

Edition {{ ed.n }}

-

{{ ed.desc }}

-
-
-
-
+
+ + +
+ {{ ed.year }} + Current + Withdrawn +
+

Edition {{ ed.n }}

+

{{ ed.iso }}

+

{{ ed.desc }}

+
    +
  • + + {{ f }} +
  • +
+
+
diff --git a/src/router.ts b/src/router.ts index ca0d0c70..c75c0eee 100644 --- a/src/router.ts +++ b/src/router.ts @@ -30,7 +30,7 @@ export const routes: RouteRecordRaw[] = [ { path: '/about', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about', navKey: 'about', basePath: '/about', title: 'About', description: 'About ISO 10303-210 (AP 210) — the STEP application protocol for electronic assembly and interconnect design data exchange.' } }, { path: '/about/scope', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-scope', navKey: 'about', basePath: '/about', title: 'Scope', description: 'Scope of AP 210 — what the standard covers including product definition, physical design, connectivity, and design rules.' } }, { path: '/about/domain', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-domain', navKey: 'about', basePath: '/about', title: 'Domain', description: 'The AP 210 domain of electronic assembly, interconnect, and packaging design — from components through complete assemblies.' } }, - { path: '/about/team', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-team', navKey: 'about', basePath: '/about', title: 'Team', description: 'People and organizations behind AP 210 — NIST, PDES Inc., ISO TC 184/SC 4, and key contributors.' } }, + { path: '/about/team', component: () => import('@/pages/about/team.vue'), meta: { navKey: 'about', basePath: '/about', title: 'Team', description: 'People and organizations behind AP 210 — NIST, PDES Inc., ISO TC 184/SC 4, and key contributors.' } }, // Standards section { path: '/standard', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'standard', navKey: 'standards', basePath: '/standard', title: 'Standards', description: 'Editions of ISO 10303-210 — four editions spanning two decades of electronic design data standardization.' } },