Evolution
@@ -164,23 +184,25 @@ END_SCHEMA;`
-
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Edition {{ ed.n }}
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{{ ed.desc }}
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+ {{ ed.year }}
+ Current
+ Withdrawn
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+ Edition {{ ed.n }}
+ {{ ed.iso }}
+ {{ ed.desc }}
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diff --git a/src/router.ts b/src/router.ts
index ca0d0c70..c75c0eee 100644
--- a/src/router.ts
+++ b/src/router.ts
@@ -30,7 +30,7 @@ export const routes: RouteRecordRaw[] = [
{ path: '/about', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about', navKey: 'about', basePath: '/about', title: 'About', description: 'About ISO 10303-210 (AP 210) — the STEP application protocol for electronic assembly and interconnect design data exchange.' } },
{ path: '/about/scope', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-scope', navKey: 'about', basePath: '/about', title: 'Scope', description: 'Scope of AP 210 — what the standard covers including product definition, physical design, connectivity, and design rules.' } },
{ path: '/about/domain', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-domain', navKey: 'about', basePath: '/about', title: 'Domain', description: 'The AP 210 domain of electronic assembly, interconnect, and packaging design — from components through complete assemblies.' } },
- { path: '/about/team', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'about-team', navKey: 'about', basePath: '/about', title: 'Team', description: 'People and organizations behind AP 210 — NIST, PDES Inc., ISO TC 184/SC 4, and key contributors.' } },
+ { path: '/about/team', component: () => import('@/pages/about/team.vue'), meta: { navKey: 'about', basePath: '/about', title: 'Team', description: 'People and organizations behind AP 210 — NIST, PDES Inc., ISO TC 184/SC 4, and key contributors.' } },
// Standards section
{ path: '/standard', component: SectionPage, meta: { contentSection: 'pages', contentSlug: 'standard', navKey: 'standards', basePath: '/standard', title: 'Standards', description: 'Editions of ISO 10303-210 — four editions spanning two decades of electronic design data standardization.' } },